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ASTM D4300:2023
Standard Guideline to Test the Ability of Adhesive Films to Support or Resist the Growth of Fungi
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ASTM D4300:2023 - Standard Guideline to Test the Ability of Adhesive Films to Support or Resist the Growth of Fungi
Application
- Aspergillus niger
- Penicillium funiculus
- Chaetomium globosum
- Trichoderma viride
Adhesive-coated disks (test) and uncoated Whatman No. 1 (control) are inoculated with fungal spore suspensions on PDA and MSA media plates.
Plates are incubated at 25 ± 0.5°C and examined at specific intervals over 21 days for fungal growth or zones of inhibition.
- Evaluates adhesive films for their ability to resist fungal degradation
- Helps manufacturers improve their antifungal products/formulations to resist fungal growth.
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Abstract
ASTM D4300 Test Requirements
The test requirements are:
Sample Preparation: Adhesive films must be prepared and conditioned as per the test’s specifications. Samples should have uniform thickness and be free from physical defects.
Testing Environment: The test is conducted in a controlled environment with specific humidity and temperature settings to promote fungal growth. A sterile chamber is used to ensure no external contamination.
Nutrient Medium: A suitable nutrient medium, such as malt extract agar, is used to facilitate fungal growth during the test. The medium must support the growth of selected test organisms without altering the properties of the adhesive film.
ASTM D4300 Test Organisms
Common test organisms include:
- Aspergillus niger: Known for its ability to colonize and degrade organic materials. Commonly found in environments with high humidity and organic debris.
- Penicillium funiculus: Thrives in moderate to high humidity environments and are capable of breaking down adhesives containing organic compounds.
- Chaetomium globosum: Capable of degrading a wide range of materials including adhesives.
- Trichoderma viride: Frequently used in testing due to its ability to grow on a variety of substrates.
ASTM D4300 Test Method
- Spores suspension is inoculated on PDA and MSA plates. Then, three adhesive-coated fiber-glass disks are placed on both media plates. In parallel, a control test is run by placing three uncoated Whatman No. 1 filter paper disks on the media surfaces. Using a sterile capillary dropping pipet, three drops of the spore suspension are inoculated on the surface of each disk on the test plates and the control plate.
- Plates are sealed with parafilm to prevent drying out during incubation. Plates are held at 25 ± 0.5°C.
- Plates with PDA media are examined at 3, 7, and 14 days for zone of inhibition (ZI) or overgrowth on the adhesive-coated disks.
- For slow-growing species, the incubation period is extended to 21 days. While plates with MSA medium are examined at 7, 14, and 21 days.
Importance of ASTM D4300 Test
ASTM D4300 stipulates the test procedure to ensure the effectiveness of antifungal adhesive films and improve optimal performance for their intended applications.
Regulatory and Compliance Standards for ASTM D4300 Test Method
Conclusion
The ASTM D4300 test method provides a comprehensive framework for evaluating the fungal resistance of adhesive films, ensuring their durability, safety, and compliance with global standards. By simulating real-world conditions, this test helps manufacturers and researchers develop products that withstand fungal challenges while meeting regulatory expectations.
At Microbial Investigations Switzerland (MIS), we specialize in offering advanced testing and validation services, including ASTM D4300. Partner with us to ensure your adhesive products meet the highest standards of microbial resistance and safety. Contact us today to learn more about our services.
Frequently Asked Questions
DR. Martinoz Scholtz
ASTM D 4300 test is designed to assess the ability of adhesive films to resist fungal growth when applied to intended areas of use.
Products such as adhesive films, coatings, sealants, and similar materials exposed to humid or fungal-prone environments can be tested with the ASTM D4300 test.
ASTM D 4300 test takes 3- 4 weeks to complete.
At Microbe Investigations, we test for ASTM E2406 using the following microbial strains :
Aspergillus niger (ATCC 9642), Aureobasidium pullulans (ATCC 15233), Chaetomium globosum (ATCC 6205), Gliocladium virens (ATCC 9645) and Penicillium pinophilum (ATCC 9644).
Yes, ASTM D4300 applies to both liquid and solid adhesives
ASTM D4300 does not specify a minimum adhesive strength; it focuses on evaluating the ability of adhesive films to support or resist fungal growth.
Factors such as environmental conditions, adhesive composition, nutrient medium quality, fungal strains, and sample preparation can significantly impact ASTM D4300 test results.
Adhesive testing using ASTM D4300 should be conducted during product development, material qualification, and periodically for quality assurance or regulatory compliance.
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